Semiconductor wafer having contact pads configured to act as probe pads

A method of testing or trimming or programming a semiconductor wafer including a first die including a first integrated circuit having at least one trimmable or programmable component, the method comprising:

• making an electrical connection to at least one probe pad, the at least one probe pad including a contact pad of a second die arranged adjacent to the first die, the contact pad of the second die being electrically connected to the at least one trimmable or programmable component of the first die;
• overlapping a first plurality of angled fingers connected to a first contact pad with a second plurality of angled fingers connected to a first trimmable or programmable component, the first plurality of angled fingers overlap the second plurality of angled fingers in an area between the first die and the second die, the overlap of the first and second plurality of angled fingers providing electrical connection between the first contact pad and the first trimmable or programmable component, the overlap of the first and second plurality of angled fingers compensate for horizontal and vertical misalignment of the first contact pad the first trimmable or programmable component;
• and
• applying an electrical signal to the contact pad of the second die to trim or permanently alter an electrical characteristic of the at least one trimmable or programmable component.