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US 12,772,802 B2Granted
End-point detection for backside metal thickness control
AssigneeHRL Laboratories, LLC
InventorFlorian G. Herrault
Life of this patent
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AssigneeHRL Laboratories, LLC
InventorFlorian G. Herrault
Estimating the term…
A method of controlling the thickness of a layer of material applied to a surface, where the surface has one or more bodies of another material disposed therein, the another material being significantly harder than the first mentioned material, the one or more bodies of another material being disposed on the surface before the layer of material is applied to the surface, the layer of material when applied to the surface having a sufficient thickness to cover the one or more bodies of the another material, the layer of material then being mechanically reduced in thickness, such as by polishing, to expose at least a portion of the one or more bodies of the another material.
An apparatus comprising an electronic element made out of a first wafer, the electronic element having a first wafer thickness with one or more end point thickness control chiplets disposed in through cavities in the electronic element, the one or more end point thickness control chiplets being made out of a second wafer and having a second thickness greater than the first wafer thickness and a first hardness, the electronic element being at least partially covered with a cover material having a hardness less than said first hardness of the end point thickness control chiplets and having a thickness limited by the thickness of the end point thickness control chiplets;
An apparatus comprising an electronic element made out of a first wafer, the electronic element having a first surface with one or more end point thickness control chiplets disposed in cavities in the electronic element, the one or more end point thickness control chiplets being made out of a second wafer and protruding from said first surface and having a first hardness, the electronic element being at least partially covered with a cover material having a hardness less than said first hardness of the end point thickness control chiplets and having a thickness limited by a distance by which the one or more end point thickness control chiplets protrude from said first surface;
Dependencies are inferred from the claim text.