Microwave heating device and method for manufacturing semiconductor packaging using the same

A method for manufacturing a semiconductor packaging, the method comprising:

• manufacturing a semiconductor element;
• and
• heating the semiconductor element using a microwave heating device,
• wherein the microwave heating device comprises:
• a microwave generator configured to generate microwaves;
• a microwave absorbing layer configured to receive the microwaves so as to be heated;
• a temperature measuring layer provided on the microwave absorbing layer;
• a sensor provided on and inside the temperature measuring layer to detect a temperature of the temperature measuring layer;
• and
• a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control power of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.