Member for semiconductor manufacturing apparatus, plug, and method of manufacturing plug

A member for semiconductor manufacturing apparatus comprising:

• a ceramic plate that has an upper surface that includes a wafer placement portion;
• and
• a plug that is installed in a plug installation hole extending through the ceramic plate in an up-down direction and that allows gas to pass therethrough,
• wherein the plug has a gas flow path that includes a plurality of linear flow paths that is combined such that the plurality of linear flow paths intersects with each other in a plug body, and
• wherein the gas flow path includes a plurality of opening portions in an upper surface and a lower surface of the plug body, and
• wherein a maximum length of the gas flow path in the up-down direction is 0.5 mm or less.