Package structure with supporting frame

A package structure, comprising:

• a carrier including at least two first metal pads;
• at least one photonic device disposed on the carrier;
• and
• a frame disposed on the carrier and surrounding the at least one photonic device, wherein the frame is not in electrical contact with the first metal pads;
• wherein the frame is a multi-layer metal structure which is tapered from bottom to top, and a tapered side of the frame is facing away from the at least one photonic device;
• wherein the frame includes a lower metal layer and a plurality of upper metal layers formed on the lower metal layer, and the lower metal layer and the plurality of upper metal layers have width differences from each other;
• wherein a distance is defined between an outer edge of the frame and the edge of the carrier.

A package structure, comprising:

• a carrier including a substrate and a plurality of first metal pads;
• a frame disposed on the carrier, an accommodating space being formed between the frame and the carrier, wherein the frame includes a lower metal layer and a plurality of upper metal layers formed on the lower metal layer, and the lower metal layer and the plurality of upper metal layers have width differences from each other;
• and
• at least one photonic device disposed in the accommodating space;
• wherein a first distance is between two of the first metal pads that are adjacent to each other, a second distance is between the frame and an adjacent one of the first metal pads, a third distance is between the outer edge of the frame and an edge of the carrier, and the first distance, the second distance, and the third distance are all greater than or equal to 0.05 millimeters.