Production method for image display device and image display device

A production method for an image display device, the method comprising:

• preparing a structure comprising a semiconductor layer formed on a first substrate, the semiconductor layer comprising a p-type semiconductor layer, a light-emitting layer, and an n-type semiconductor layer;
• forming a layer that has hole injectability on the semiconductor layer;
• after forming the layer that has hole injectability, forming a metal layer on the structure;
• bonding the semiconductor layer to a second substrate via the metal layer, wherein the p-type semiconductor layer, the light-emitting layer, and the n-type semiconductor layer are located in this order from a second substrate side;
• removing the first substrate;
• forming a light-emitting element by etching the semiconductor layer, the light-emitting element including a bottom surface on the metal layer, and a light-emitting surface located opposite to the bottom surface;
• after the forming of the light-emitting element, forming a conductive part by patterning the metal layer, the conductive part being light-reflective, wherein the light-emitting element is located on the conductive part, and wherein an outer perimeter of the conductive part includes an outer perimeter of the light-emitting element when the light-emitting element is projected in a plan view;
• forming a first insulating film that covers the second substrate and the light-emitting element;
• forming a transistor on the first insulating film;
• forming a second insulating film that covers the transistor and the first insulating film;
• exposing a surface that includes the light-emitting surface by removing a portion of the first insulating film and a portion of the second insulating film;
• forming a via that extends through the first and second insulating films;
• forming a wiring layer on the second insulating film, wherein the wiring layer is electrically connected to the conductive part by the via, and wherein the transistor is electrically connected to the light-emitting element at least by the wiring layer;
• and
• forming a light-transmitting electrode on the exposed light-emitting surface.