Electronic device and manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• providing a driving back board and a light-emitting element array base, wherein the driving back board comprises a plurality of pad sets, and the light-emitting element array base comprises a temporary storage base, an adhesive layer disposed on the temporary storage base, and a plurality of light-emitting elements disposed on the adhesive layer;
• forming a sealant on one of the driving back board and the light-emitting element array base;
• forming an auxiliary element on one of the driving back board and the light-emitting element array base, wherein the auxiliary element is formed in a closed-ring configuration;
• making the light-emitting element array base and the driving back board aligned and pressed together in a near-vacuum environment, so that the light-emitting elements are aligned with the pad sets, the light-emitting element array base is connected with the driving back board through the sealant, the sealant is disposed on the temporary storage base and surrounds the adhesive layer, and the auxiliary element is disposed on the temporary storage base between the adhesive layer and at least a portion of the sealant;
• and
• performing a soldering process, so that the light-emitting elements are bonded with the pad sets.