Repairing component including micro-LED chip and production method thereof, repairing method, method for producing light emitting device, and light emitting device

A repairing component comprising:

• micro-LED chips, each of which including an electrode and having an electrode plane on which the electrode is disposed;
• and
• first anisotropic conductive layers, each of which being disposed to be in contact with the electrode disposed on the electrode plane of each of the micro-LED chips, where each of the first anisotropic conductive layers has an area matching with an area of a corresponding electrode plane of the micro-LED chips;
• at least one second anisotropic conductive layer on which no light-emitting elements are disposed;
• and
• a base disposed to be in contact with each plane of the first anisotropic conductive layers, the each plane of the first anisotropic conductive layers being at an opposite side to each plane of the first anisotropic conductive layers where each of the micro-LED chips is disposed, wherein
• a plurality of laminates are disposed on the base in a manner that the plurality of laminates are set apart from one another, where each laminate of the plurality of laminates includes each of the micro-LED chips and each of the first anisotropic conductive layers, and
• the at least one second anisotropic conductive layer is disposed on the base.