Semiconductor package and method of fabricating the same

A semiconductor package comprising:

• a first semiconductor chip including a first chip conductive pad disposed on an upper surface thereof;
• at least one second semiconductor chip disposed on the first semiconductor chip, the at least one second semiconductor chip including a second chip conductive pad disposed on a lower surface thereof;
• a solder ball connecting the first chip conductive pad to the second chip conductive pad;
• a photosensitive insulating layer filling a space between the first semiconductor chip and the at least one second semiconductor chip;
• a first organic insulating layer covering a side surface of the second chip conductive pad;
• and
• a second organic insulating layer covering a side surface of the first chip conductive pad.

A semiconductor package comprising:

• a first semiconductor chip including a first chip upper conductive pad disposed on an upper surface thereof;
• a plurality of second semiconductor chips stacked on the first semiconductor chip, each of the second semiconductor chips including a second chip upper conductive pad disposed on an upper surface thereof and a second chip lower conductive pad disposed on a lower surface thereof;
• a first solder ball connecting the second chip lower conductive pad of a lowermost one of the second semiconductor chips to the first chip upper conductive pad;
• a second solder ball disposed between the second semiconductor chips;
• a first photosensitive insulating layer filling a space between the lowermost one of the second semiconductor chips and the first semiconductor chip;
• a second photosensitive insulating layer filling a space between the second semiconductor chips;
• a first organic insulating layer covering a side surface of the first chip upper conductive pad;
• a second organic insulating layer covering a side surface of the second chip lower conductive pad;
• and
• a third organic insulating layer covering a side surface of the second chip upper conductive pad.