Method for manufacturing wiring substrate

A method for manufacturing a wiring substrate, comprising:

• preparing a first support plate having a metal foil formed on a surface of a support substrate;
• forming a wiring substrate on the metal foil of the first support plate such that the wiring substrate has a first surface facing the metal foil of the first support plate;
• attaching a second support plate to a second surface of the wiring substrate on an opposite side with respect to the first surface;
• and
• separating the support substrate from the metal foil of the first support plate after the attaching of the second support plate such that the metal foil of the first support plate is removed from the first surface of the wiring substrate and that the first surface of the wiring substrate is exposed,
• wherein the wiring substrate has a plurality of first conductor pads formed on the first surface, and a plurality of second conductor pads formed on the second surface, the method for manufacturing the wiring substrate includes conducting a first conduction inspection such that conduction between the plurality of second conductor pads is inspected before the attaching of the second support plate to the second surface of the wiring substrate, and conducting a second conduction inspection such that conduction between the plurality of first conductor pads is inspected after the removing of the metal foil from the first surface of the wiring substrate, and the first conduction inspection is conducted in a state in which the first support plate is attached to the first surface, and the second conduction inspection is conducted in a state in which the second support plate is attached to the second surface.