Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method
AssigneeToppan Holdings Inc.
InventorYuki Umemura
Life of this patent
Estimating the term…
Abstract
A glass substrate includes a through hole that penetrates the glass substrate from a first surface to a second surface. The through hole has a minimum bore diameter in the through hole in a section of 1% to 10% from the first surface in a section from the first surface to the second surface.
Claims9
A glass substrate, comprising a through hole that penetrates the glass substrate from a first surface to a second surface, wherein the through hole has a minimum bore diameter in the through hole in a section of 1% to 10% from the first surface in a section from the first surface to the second surface, wherein the through hole has a chamfered shape on the second surface side, and when a point at which an inner wall surface between the minimum point and the chamfered shape crosses an aperture of the second surface is defined as a crossing point and a point at which the chamfered shape reaches the second surface is defined as a terminal point in the cross section of the through hole including the center axis of the through hole, a distance between the crossing point and the terminal point is greater than or equal to 1um and less than or equal to 20 μm.
A through electrode that is formed in a glass substrate including a through hole that penetrates the glass substrate from a first surface to a second surface, wherein the through electrode has a first tapered shape in which a bore diameter grows larger from a minimum point in a section of 10% from the first surface to the first surface, and a second tapered shape in which the bore diameter grows larger from the minimum point to an aperture of the second surface in a section from the first surface to the second surface in a cross section including a center axis of the through hole, wherein the through hole has a chamfered shape on the second surface side, and when a point at which an inner wall surface between the minimum point and the chamfered shape crosses an aperture of the second surface is defined as a crossing point and a point at which the chamfered shape reaches the second surface is defined as a terminal point in the cross section of the through hole including the center axis of the through hole, a distance between the crossing point and the terminal point is greater than or equal to 1 μm and less than or equal to 20 μm.
Dependencies are inferred from the claim text.