Semiconductor module and method for fabricating a semiconductor module

A method for fabricating a semiconductor module, the method comprising:

• providing a printed circuit board comprising a first side and an opposite second side;
• arranging a plurality of power semiconductor packages over the first side of the printed circuit board such that a first side of the power semiconductor packages faces the first side of the printed circuit board and electrically couples the power semiconductor packages to the printed circuit board, wherein a second side of the power semiconductor packages opposite the first side of the power semiconductor packages is configured to be coupled to a heatsink, wherein each of the power semiconductor packages comprises at least one power semiconductor die arranged on a die carrier, an encapsulation encapsulating the power semiconductor die, and external contacts exposed from the encapsulation and electrically coupled to the first side of the printed circuit board;
• and
• arranging at least one bus bar over the first side of the printed circuit board and electrically coupling the bus bar to the printed circuit board,
• wherein the bus bar is physically separate from each of the power semiconductor packages and configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages.

A method for fabricating a power electronic system, the method comprising:

• providing a semiconductor module, the semiconductor module comprising:
• a printed circuit board comprising a first side and an opposite second side;
• a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, wherein a first side of the power semiconductor packages faces the first side of the printed circuit board and an opposite second side of the power semiconductor packages is configured to be coupled to a heatsink, wherein each of the power semiconductor packages comprises at least one power semiconductor die arranged on a die carrier, an encapsulation encapsulating the power semiconductor die, and external contacts exposed from the encapsulation and electrically coupled to the first side of the printed circuit board;
• and at least one bus bar arranged over and electrically coupled to the first side of the printed circuit board, wherein the bus bar is physically separate from each of the power semiconductor packages and configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages;
• and
• arranging a heatsink over the first side of the printed circuit board such that the power semiconductor packages and the bus bar are covered by the heatsink.