Electronic device

Abstract

An electronic device is provided. The electronic device includes a first panel including a first substrate, a second substrate, a plurality of first conductive pads, a first conductive ring, and a first electrostatic protection structure. The first substrate includes a first electronic component bonding area. The second substrate is disposed opposite to the first substrate. The plurality of first conductive pads are disposed on the first electronic component bonding area. The first conductive ring is disposed on the first substrate. The first electrostatic protection structure includes a first line end portion and a second line end portion that are opposite to each other. The first line end portion is connected to one of the plurality of first conductive pads. The second line end portion is connected to the first conductive ring. Moreover, the first conductive ring is electrically connected to a ground potential.

Dependencies are inferred from the claim text.