Apparatus for treating substrate
AssigneeSemes Co., Ltd.
InventorsHanglim Lee, Minyoung Kim, Jihoon Park
Life of this patent
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Abstract
Disclosed is a substrate treating apparatus that includes an index module including a plurality of load ports on each of which a carrier having a substrate received therein is placed and a transfer frame in which an index robot that transfers the substrate is installed, a process module that is connected with the index module and that includes process chambers in each of which the substrate is treated, and a substrate treating unit that is provided in the index module and that treats the substrate, the substrate treating unit being provided along a direction in which the plurality of load ports are arranged.
Claims7
A substrate treating unit comprising:
- a spin chuck having a substrate placed thereon;
- a lower electrode provided on the spin chuck;
- and
- a plasma generation apparatus located over the spin chuck and configured to generate plasma,
- wherein the plasma generation apparatus includes:
- a first upper electrode unit configured to perform plasma treatment on an entire surface of the substrate;
- a first actuator configured to move horizontally the first upper electrode unit over the spin chuck along a first direction;
- a second upper electrode unit configured to perform plasma treatment on a local area of the substrate;
- and
- a second actuator configured to move the second upper electrode unit along a second direction perpendicular to the first direction,
- wherein the second upper electrode unit is installed on a drive rail provided to the first upper electrode unit.
Dependencies are inferred from the claim text.