Electronic component and mounting structure of electronic component

An electronic component mounting structure, comprising:

• a board;
• and
• an electronic component mounted on the board, wherein
• the electronic component includes a base body, an internal electrode located inside the base body, and an external electrode covering a part of an outer surface of the base body,
• the external electrode includes a first electrode covering a part of an outer surface of the base body and connected to the internal electrode, and a second electrode covering an outer surface of the first electrode,
• the second electrode includes spherical copper particles and silicon,
• when a surface, of the outer surface of the base body, facing the board is a mounting surface,
• the first electrode covers at least a part of the mounting surface,
• the second electrode covers at least an outer surface of a portion, of the outer surface of the first electrode, covering the mounting surface, and
• an average size of the spherical copper particles is different in a first part of the second electrode than in a second part of the spherical electrode.