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US 12,768,881 B2Granted
Interposer instrumentation method and apparatus
AssigneeTexas Instruments Incorporated
InventorLee D. Whetsel
Life of this patent
Estimating the term…
Abstract
The disclosure describes a novel method and apparatus for improving interposers to include embedded monitoring instruments for real time monitoring digital signals, analog signals, voltage signals and temperature sensors located in the interposer. An embedded monitor trigger unit controls the starting and stopping of the real time monitoring operations. The embedded monitoring instruments are accessible via an 1149.1 TAP interface on the interposer.
Claims20
A device comprising:
- a plurality of first terminals;
- a first temperature sensor;
- a second temperature sensor;
- an intermediate die including:
- a first surface on which a plurality of first contact points are formed, wherein each of the first contact points is physically coupled to at least corresponding one of the first terminals;
- a second surface on which a plurality of second contact points are formed;
- a plurality of through holes filled with conductive material, wherein the conductive material of each of the through holes electrically couples at least corresponding one of the first contact points and at least corresponding one of the second contact points;
- and
- a temperature monitor circuit coupled to the first temperature sensor, coupled to the second temperature sensor and configurable to:
- receive a test data input from the plurality of first terminals;
- and
- select the first temperature sensor or the second temperature sensor based on the test data input;
- and
- at least one die including a plurality of second terminals and a die circuit electrically coupled to the second terminals, wherein each of the second terminals is physically coupled to at least corresponding one of the second contact points.
11 more elements
A device comprising:
- a first temperature sensor;
- a second temperature sensor;
- an intermediate die including:
- a first surface on which a plurality of first contact points are formed;
- a second surface on which a plurality of second contact points are formed, wherein the first surface is positioned on an opposite side of the intermediate die from the second surface;
- a plurality of through holes filled with conductive material, wherein the conductive material of each of the through holes electrically couples at least corresponding one of the first contact points and at least corresponding one of the second contact points;
- and
- a temperature monitor circuit coupled to the first temperature sensor, coupled to the second temperature sensor, and including an analog-to-digital converter operable to convert an analog signal from the first temperature sensor or from the second temperature sensor to a digital value;
- and
- at least one die including a plurality of second terminals and a die circuit electrically coupled to the second terminals, wherein each of the second terminals is physically coupled to at least corresponding one of the second contact points.
7 more elements
Dependencies are inferred from the claim text.