Chamber architecture for epitaxial deposition and advanced epitaxial film applications

A process chamber for substrate processing, comprising:

• an upper lamp module;
• a lower lamp module;
• a susceptor assembly disposed between the upper lamp module and the lower lamp module, the susceptor assembly comprising:
• a support shaft having a top distal end and a bottom distal end;
• a susceptor connected to the top distal end of the support shaft, the susceptor comprising:
• a substrate support surface;
• a bottom surface opposite the substrate support surface;
• an outer ledge disposed radially outward of the substrate support surface, the outer ledge surrounding an outer edge of the substrate support surface, the outer ledge vertically offset below the substrate support surface;
• and
• a shaft coupling disposed on the bottom surface, the shaft coupling connecting the susceptor to the top distal end of the support shaft;
• and
• a movement assembly connected to the bottom distal end of the support shaft, the bottom distal end of the support shaft at least partially disposed within the movement assembly, the movement assembly comprising:
• a bearing feedthrough assembly;
• an upper window disposed between the upper lamp module and the susceptor assembly;
• a lower window disposed between the lower lamp module and the susceptor assembly;
• a chamber body assembly disposed between the upper lamp module and the lower lamp module and forming a portion of a process volume, the chamber body assembly comprising:
• a base ring comprising:
• a substrate transfer passage disposed through the base ring;
• a lower chamber exhaust passage disposed opposite the substrate transfer passage and through the base ring;
• and
• one or more upper chamber exhaust passages, each of the one or more upper chamber exhaust passages having an upper chamber exhaust passage opening disposed above the lower chamber exhaust passage;
• and
• an inject ring disposed above the base ring, the inject ring comprising:
• one or more injector passages disposed through the inject ring and above the substrate transfer passage;
• and
• one or more indents disposed between an inner surface of the inject ring and a bottom surface of the inject ring, the one or more indents disposed above the one or more upper chamber exhaust passage openings and fluidly coupled to the one or more upper chamber exhaust passages;
• an upper liner disposed inside of and adjacent to the inject ring;
• and
• a lower liner disposed inside of and adjacent to the base ring.