Thermally conductive silicone composition

A thermally conductive composition comprising:

• (A) a curable silicone composition comprising:
• (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30 to 400 milliPascal*seconds,
• (a2) a silicon-hydride functional crosslinker, and
• (a3) a hydrosilylation catalyst,
• where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1;
• (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane;
• and
• (C) a thermally conductive filler mixture comprising, based on the weight of the thermally conductive composition,
• (c1) from 40 weight-percent to 55 weight-percent of aluminum nitride fillers, comprising a blend of:
• (c1-a) from 15 weight-percent to 41 weight-percent of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and
• (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of from 20 to 80 micrometers;
• (c2) spherical aluminum oxide particles having a D50 particle size of from 1 to 5 micrometers;
• and
• (c3) from 10 weight-percent to 20 weight-percent of irregular zinc oxide particles having a D50 particle size of from 0.1 to 0.5 micrometer;
• where the total amount of the thermally conductive filler mixture is from 94 weight-percent to 97 weight-percent, based on the weight of the thermally conductive composition.