Resin composition, molded article, and method for manufacturing plated molded article
AssigneeMitsubishi Engineering-Plastics Corporation
InventorsTatsuya Kikuchi, Rina Takeuchi, Yohei Nishino
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Engineering-Plastics Corporation
InventorsTatsuya Kikuchi, Rina Takeuchi, Yohei Nishino
Estimating the term…
To provide a resin composition having high relative permittivity, while keeping low loss tangent, and excellent mechanical strength; a molded article; and a method for manufacturing a plated molded article. A resin composition comprising: per 100 parts by mass of a thermoplastic resin, 0.3 to 10 parts by mass an acid-modified polymer; 5 to 150 parts by mass of a laser direct structuring additive; and 10 to 150 parts by mass of a reinforcing fiber, the laser direct structuring additive being a compound being a conductive oxide having a resistivity of 5×103 Ω·cm or smaller, and containing at least one type selected from a Group n (n represents an integer of 3 to 16) metal in the periodic table and a Group n+1 metal, or, calcium copper titanate.
A resin composition comprising:
Dependencies are inferred from the claim text.