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US 12,767,792 B2Granted
One-component thermosetting epoxy composition with improved adhesion
AssigneeSika Technology AG
InventorsShunsuke Yamada, Satoshi Urayama
Life of this patent
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Abstract
A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.
Claims15
A one-component thermosetting epoxy resin composition comprising:
- 20-55 weight-% of at least one epoxy resin A having on average more than one epoxide group per molecule;
- 1-6 weight % of at least one latent hardener B for epoxy resins;
- 0-3 weight-% of at least one accelerator C;
- 15-50 weight-% of at least one impact modifier D;
- 0.01-5 weight-% of at least one physical or chemical blowing agent E;
- 2-35 weight-% of a fibrous anhydrous magnesium oxysulfate MOS;
- wherein the thermosetting epoxy resin composition has a needle penetration value (in 0.1 mm) of 20-80 using a total load (weight of the needle and related parts) of 100 g for 5 second with a needle thickness of 1 mm at 23° C.
4 more elements
Dependencies are inferred from the claim text.