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US 12,767,522 B2Granted
MEMS microphone package
AssigneeFortemedia, Inc.
InventorsYen-Son Paul Huang, Iou-Din Jean Chen, Shih-Chung Wang, Yung-Wei Chen
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AssigneeFortemedia, Inc.
InventorsYen-Son Paul Huang, Iou-Din Jean Chen, Shih-Chung Wang, Yung-Wei Chen
Estimating the term…
A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package also includes a sensor disposed on the substrate and having a connecting structure disposed on the bottom of the sensor. The connecting structure is electrically connected to the substrate and the circuit device. The MEMS microphone package further includes a cap covering the circuit device and the sensor and separated from the circuit device and the sensor.
A MEMS microphone package, comprising:
Dependencies are inferred from the claim text.