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US 12,767,517 B2Granted
MEMS microphone and method for fabricating the same
AssigneesHyundai Motor Company, Kia Corporation
InventorsIlseon Yoo, Sang-Hyeok Yang, Dong Gu Kim, Hyunsoo Kim
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Abstract
A MEMS microphone according to an embodiment comprises a substrate including an air chamber in a central portion, a back-plate disposed above the substrate and including a plurality of penetration holes through which a sound wave passes, and a vibration membrane disposed between the back-plate and the substrate, forming compressive residual stress, having a base form convexly bent toward the back-plate, and configured to vibrate a sound pressure transferred through the plurality of penetration holes.
Claims7
A MEMS microphone, comprising:
- a substrate including an air chamber in a central portion;
- a back-plate disposed above the substrate and including a plurality of penetration holes through which a sound wave passes;
- and
- a vibration membrane disposed between the back-plate and the substrate, forming compressive residual stress, having a base form convexly bent toward the back-plate, and configured to vibrate a sound pressure transferred through the plurality of penetration holes,
- wherein the vibration membrane comprises:
- a corrugation portion disposed within a range of the air chamber;
- and
- a bent portion located radially inside the corrugation portion, and located closer to the back-plate in comparison with a part of the vibration membrane radially outside the corrugation portion,
- wherein the base form of the vibration membrane means a form of the vibration membrane at a free state, in which no sound pressure is applied to the vibration membrane and no voltage is applied between the back-plate and the vibration membrane,
- wherein, in the base form of the vibration membrane, the vibration membrane is configured to support the bent portion toward the back-plate by the compressive residual stress of the vibration membrane.
7 more elements
Dependencies are inferred from the claim text.