Medium processing device and liquid application system

A liquid application system comprising:

• a liquid application device that applies a liquid to a liquid adhering surface of a medium;
• a drying device that performs a drying treatment on the medium having the liquid adhering surface to which the liquid is applied;
• and
• a contact member that first comes into contact with the liquid adhering surface of the medium subjected to the drying treatment using the drying device, to which the liquid is adhered, after the drying treatment,
• wherein the drying device performs the drying treatment on the medium so that a mass of the liquid per unit area on the liquid adhering surface of the medium is 200 micrograms per square centimeter or less,
• the contact member has a cooling structure that cools the medium,
• bonding work of a contact surface that comes into contact with the liquid adhering surface with respect to a liquid applied region of the liquid adhering surface of the medium where the liquid is applied is 81 millinewtons per meter or less, and
• Vickers hardness of the contact surface is 450 Hv or more and 600 Hv or less.