Protective film, resin substrate, laminate of protective film and resin substrate, resin sheet laminate, and protective film set

A resin sheet laminate comprising:

• a light-transmitting resin sheet having light-transmitting properties;
• and
• protective films peelably laminated on both surfaces of the light-transmitting resin sheet,
• wherein one protective film contains a light-shielding material and has light-shielding property, and
• at least one of the other protective film and the light-transmitting resin sheet is colored in a color different from that of the light-shielding material.

A protective film which is used by being attached to a resin substrate in a case of performing heat bending on the resin substrate while heating the resin substrate, the protective film comprising:

• a base material layer;
• and
• a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate, and is adhered to the resin substrate,
• wherein the base material layer is composed of a laminate including a first layer which is positioned on a side opposite to the pressure sensitive adhesive layer and a second layer which is positioned on a side of the pressure sensitive adhesive layer,
• wherein the first layer contains a thermoplastic resin as a main material and a melting point of the first layer is 150° C. or higher,
• the second layer contains a thermoplastic resin as a main material and a melting point of the second layer is 120° C. or higher, and
• the pressure sensitive adhesive layer contains a thermoplastic resin as a main material and a melting point of the pressure sensitive adhesive layer is 110° C. or lower, and
• the pressure sensitive adhesive layer has a surface roughness Ra of 0.20 μm or less in a surface on a side of the resin substrate, which is measured in accordance with JIS B 0601, and in a case where, using an autograph manufactured by Shimadzu Corporation (tensile speed:
• 500 mm/min), a test piece (No. 1 dumbbell) obtained from the protective film was measured in accordance with JIS K 7127 under an atmosphere of 23° C. and 60% RH, an elastic modulus of the test piece is in a range of 300 MPa or more and 600 MPa or less.

A protective film which is used by being attached to a resin substrate in a case of performing heat bending on the resin substrate while heating the resin substrate, and subsequently being peeled off from the resin substrate after the heat bending, the protective film comprising:

• a base material layer;
• and
• a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate, and is adhered to the resin substrate,
• wherein the base material layer is composed of a laminate including a first layer which is positioned on a side opposite to the pressure sensitive adhesive layer and a second layer which is positioned on a side of the pressure sensitive adhesive layer,
• wherein the second layer consists of homo polypropylene (h-PP) and styrene-ethylene-propylene-styrene block copolymer (SEPS), h-PP and styrene-ethylene-butylene-styrene block copolymer (SEBS), or block polypropylene (b-PP), and
• the protective film is configured such that, in a case where the protective film is peeled off from the resin substrate, a surface of the pressure sensitive adhesive layer on a side of the resin substrate is charged with a negative charge, and by the negative charge, a surface of the resin substrate on a side of the pressure sensitive adhesive layer is charged with a positive charge.

A protective film which is used by being attached to a resin substrate in a case of performing heat bending on the resin substrate while heating the resin substrate, the protective film comprising:

• a base material layer;
• and
• a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate, and is adhered to the resin substrate,
• wherein the base material layer is composed of a laminate including a first layer which is positioned on a side opposite to the pressure sensitive adhesive layer and a second layer which is positioned on a side of the pressure sensitive adhesive layer,
• wherein the pressure sensitive adhesive layer consists of at least one selected from linear low-density polyethylene (LLDPE) and high-density polyethylene (HDPE) having a melting point of 106° C. or higher, and at least one selected from ethylene-methacrylic acid copolymer (EMMA), ethylene-methyl acrylate copolymer (EMA), LLDPE having a melting point of 93° C. or lower, an α-polyolefin resin/polyethylene copolymer elastomer, an α-polyolefin resin/polypropylene copolymer elastomer and an α-polyolefin resin/polybutene copolymer elastomer, and
• the pressure sensitive adhesive layer contains polyolefin having pressure sensitive adhesiveness as a main material and has two or more different melting points.