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US 12,766,664 B2Granted
Polish apparatus and methods for use
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hsiang Yen, Peng-Chung Jangjian
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Abstract
A chemical mechanical polish apparatus and methods for manufacturing and use of the chemical mechanical polishing apparatus are discussed herein. In an embodiment, a polishing apparatus is provided that includes: a polishing pad coated with polypeptides; and an enzyme spraying device positioned adjacent to the polishing pad.
Claims20
A method of polishing comprising:
- introducing a slurry comprising of particulates to a polishing pad layered with polypeptide chains, wherein introducing the slurry electrostatically adheres at least some of the particulates to the polypeptide chains;
- and
- introducing a cleaning solution to the polishing pad, wherein introducing the cleaning solution changes an electrostatic charge of either the polypeptide chains or the particulates to detach the particulates from the polypeptide chains.
A method of polishing comprising:
- dispensing a slurry solution at a first pH value onto a first surface of a polishing pad, the first surface of the polishing pad comprising a plurality of polypeptide chains, wherein the slurry solution comprises abrasives that adhere to the plurality of polypeptide chains when in an environment at the first pH value;
- and
- after dispensing the slurry solution, water polishing the polishing pad, wherein the water polishing adjusts the slurry solution with the first pH to a second pH, wherein the abrasives detach from the plurality of polypeptide chains when the environment is at the second pH.
A method of polishing comprising:
- dispensing a bulk slurry at a first pH value onto a first polishing pad coated with first polypeptide chains, wherein the first pH value causes a moiety charge on peptide residues within the first polypeptide chains that electrostatically adheres first abrasives in the bulk slurry to the first polypeptide chains;
- removing excess material from a workpiece using the first polishing pad;
- dispensing a buffing slurry at a second pH value onto a second polishing pad coated with second polypeptide chains, wherein the second pH value causes a moiety charge on peptide residues within the second polypeptide chains that electrostatically adheres second abrasives in the buffing slurry to the second polypeptide chains;
- and
- buffing the workpiece using the second polishing pad.
2 more elements
Dependencies are inferred from the claim text.