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US 12,766,662 B2Granted
Polishing apparatus with microwave detection sensor
AssigneeEbara Corporation
InventorSeungho Yun
Life of this patent
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Abstract
A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data.
Claims3
A polishing apparatus comprising:
- a polishing table configured to rotatably support a polishing pad;
- a polishing head configured to rotatably hold a substrate and press the substrate against the polishing pad;
- a microwave detection sensor embedded in the polishing table and configured to generate microwave detection data by detecting microwaves derived from the substrate through the polishing pad;
- and
- a controller configured to:
- generate temperature distribution information indicating a temperature distribution of the substrate along a direction perpendicular to a surface of the substrate based on the microwave detection data;
- and
- determine a highest temperature among the temperature distribution information as a surface temperature of the substrate.
5 more elements
Dependencies are inferred from the claim text.