Electrical redundancy for bonded structures

A bonded structure, comprising:

• a first element having a first surface comprising a first plurality of metal pads and a first nonconductive field region, wherein a shortest distance in a cross-sectional view between two adjacent metal pads of the first plurality of metal pads defines a first spacing;
• and
• a second element having a second surface comprising a second plurality of metal pads and a second nonconductive field region, the first nonconductive field region being directly bonded to the second nonconductive field region and at least some of the first plurality of metal pads being directly bonded to metal pads of the second plurality of metal pads,
• wherein a third plurality of metal pads is defined by metal pads of the first plurality of metal pads that are electrically shorted to one another, and
• wherein a metal pad of the third plurality of metal pads is separated from its nearest adjacent metal pad in the third plurality of metal pads by a second spacing in the cross-sectional view, the second spacing being greater than the first spacing.