Semiconductor device and method for manufacturing semiconductor device

A semiconductor device comprising:

• a substrate that includes an external terminal;
• a first semiconductor chip on or above which a first bonding pad is arranged;
• a second semiconductor chip that is arranged between the substrate and the first semiconductor chip, the second semiconductor chip on or above which a second bonding pad and a first insulating film being arranged;
• a bonding wire that connects the substrate, the first bonding pad, and the second bonding pad;
• and
• a sealing resin that seals at least the first semiconductor chip, the second semiconductor chip, and the bonding wire, wherein:
• the second semiconductor chip includes a first surface that faces the substrate, and a second surface on an opposite side of the first surface;
• and
• the second surface includes
• a first bonding region where the second bonding pad and the first insulating film are arranged, and
• a first lamination region that has a first low-level surface formed that being lower than a surface of the first insulating film, the first semiconductor chip being arranged on or above at least a part of the first low-level surface.