Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorAkira Iso
Life of this patent
Estimating the term…
Abstract
a A semiconductor device, including a board, semiconductor module disposed on a front surface of the board, and a case that includes (1) side wall portions that are disposed on the front surface of the board and that surround, with the board, a storage area including the semiconductor module, (2) a cover portion that is disposed on the side wall portions to cover the storage area, the cover portion having a terminal opening formed therein, and (3) a guiding projection portion formed on an inner surface of the cover portion, and protruding toward the storage area. The semiconductor device further includes sealing material with which the storage area is filled and which seals the semiconductor module. The guiding projection portion has a projecting end portion that is in contact with the sealing material.
Claims19
A semiconductor device, comprising:
- a board;
- a semiconductor module disposed on a front surface of the board;
- a case that includes:
- side wall portions that are disposed on the front surface of the board, and that surround, with the board, a storage area in which the semiconductor module is disposed,
- a cover portion that is disposed on the side wall portions to cover the storage area, the cover portion having a terminal opening formed therein, and
- two guiding projection portions formed on an inner surface of the case, and protruding toward the storage area from an upper portion of the case, the two guiding projection portions being on two opposite sides of the terminal opening, respectively, and not being in direct contact with each other;
- and
- sealing material with which the storage area is filled to thereby seal the semiconductor module, wherein
- each of the guiding projection portions has a projecting end portion that is in contact with the sealing material.
A semiconductor device, comprising:
- a board;
- a semiconductor module disposed on a front surface of the board;
- a case that includes:
- side wall portions that are disposed on the front surface of the board, and that surround, with the board, a storage area in which the semiconductor module is disposed,
- a cover portion that is disposed on the side wall portions to cover the storage area, the cover portion having a terminal opening formed therein, and
- a guiding projection portion formed on an inner surface of the cover portion, and protruding toward the storage area;
- sealing material with which the storage area is filled to thereby seal the semiconductor module;
- and
- a circulatory projection portion that is formed on the inner surface of the cover portion and between the terminal opening and the guiding projection portion in a plan view of the semiconductor device, and that protrudes toward the storage area without being in contact with the sealing material,
- wherein the guiding projection portion has a projecting end portion that is in contact with the sealing material,
- wherein the guiding projection portion continuously and fully surround the terminal opening in the plan view, and
- wherein the circulatory projection portion continuously and fully surround the terminal opening, and is between the guiding projection portion and the terminal opening, in the plan view.
Dependencies are inferred from the claim text.