Semiconductor package with hybrid interconnect clip

A semiconductor package, comprising:

• first and second lead frames, each comprising a die pad and a plurality of contacts that are connected with and vertically offset from the die pad;
• first and second semiconductor dies, each comprising a first terminal disposed on an upper surface and a second terminal disposed on a lower surface;
• and
• a first clip frame that comprises a first die mating pad, a second die mating pad, and a bridge section that extends between the first and second die mating pads;
• wherein the first semiconductor die is mounted on the first lead frame such that the second terminal of the first semiconductor die faces and electrically connects with the die pad of the first lead frame;
• wherein the second semiconductor die is mounted on the second lead frame such that the second terminal of the second semiconductor die faces and electrically connects with the die pad of the second lead frame, and
• wherein the first clip frame is attached to the first and second semiconductor dies such that the first die mating pad faces and electrically connects with the first terminal of the first semiconductor die and such that the second die mating pad faces and electrically connects with the first terminal of the second semiconductor die.

A semiconductor package, comprising:

• first and second lead frames, each comprising a die pad and a plurality of contacts that are connected to the die pad;
• first and second semiconductor dies mounted on the die pads of the first and second lead frames, respectively, each of the first and second semiconductor dies being transistor dies;
• a first clip frame that comprises a first die mating pad, a second die mating pad, and a bridge section that extends between the first and second die mating pads;
• and
• a package body of electrically insulating encapsulant material that encapsulates the first semiconductor die and the second semiconductor die,
• wherein the first and second semiconductor dies are arranged as a bidirectional switch that is configured to control current flowing in two directions,
• wherein the contacts of the first and second lead frames form input-output terminals of the bidirectional switch that are exposed from the package body, and
• wherein the bridge section forms a central terminal of the bidirectional switch that is exposed from the package body.