Semiconductor apparatus

Abstract

The present technology relates to a semiconductor apparatus that makes it possible to make a sensor-chip package smaller in size, where a Peltier element is arranged in the sensor-chip package. The semiconductor apparatus includes a package that includes a concave portion; a sensor chip that is arranged in the concave portion; and a Peltier element that is arranged between the sensor chip and the package. A back-surface terminal and an upper-surface terminal are electrically connected to each other through a conductive resin, the back-surface terminal being formed on a back surface of a lower substrate of the Peltier element, the upper-surface terminal being formed on an upper surface of the concave portion to face the back-surface terminal. The present technology is applicable to, for example, a semiconductor apparatus that includes a built-in SWIR image sensor.

Dependencies are inferred from the claim text.