Back to results
US 12,765,369 B2Granted
Method of forming semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Hsien-Wei Chen, Ming-Fa Chen
Life of this patent
Estimating the term…
Abstract
A method of forming a semiconductor package includes the following steps. A first die is provided, wherein the first die comprises a plurality of first conductive patterns. A plurality of second conductive patterns are formed over the first die, wherein the second conductive patterns are connected to the first conductive patterns to form a first coil and a second coil surrounding the first coil.
Claims20
A method of forming a semiconductor package, comprising:
- forming a plurality of first conductive patterns over a semiconductor substrate along a first direction;
- and
- forming a plurality of second conductive patterns stacked over the first conductive patterns along the first direction, wherein the second conductive patterns are connected to the first conductive patterns to form a first coil and a second coil surrounding the first coill, the first coil has a first total height extended along the first direction, the second coil has a second total height along the first direction, and the second total height is different from the first total height.
A method of forming a semiconductor package, comprising:
- forming a plurality of first conductive layers and a plurality of first conductive vias alternately stacked along a first direction;
- forming a plurality of through vias over the first conductive layers and the first conductive vias;
- and
- forming a plurality of second conductive layers and a plurality of second conductive vias over the through vias,
- wherein the through vias, the first conductive layers, the first conductive vias, the second conductive layers and the second conductive vias are connected to form an inductor having a first coil and a second coil surrounding the first coil, and the first coil and the second coil are around an axis substantially perpendicular to the first direction.
2 more elements
A method of forming a semiconductor package, comprising:
- providing a first die;
- stacking a second die on the first die along a first direction;
- forming a first inductor over the first die, the first inductor comprising a plurality of first coils around a first axis, wherein the first axis is substantially perpendicular to the first direction, and one of the first coils surrounds another one of the first coils;
- and
- forming a second inductor over the first die, wherein the second inductor includes a plurality of second coils around a second axis, wherein the first inductor and the second inductor are physically separated.
2 more elements
Dependencies are inferred from the claim text.