Dielectric plugs for advanced integrated circuit structure fabrication

An integrated circuit structure, comprising:

• a plurality of conductive lines along a same direction, one of the conductive lines having a break therein;
• a dielectric hardmask layer having portions between adjacent ones of the plurality of conductive lines and having a portion in a location of the break in the one of the conductive lines;
• and
• an inter-layer dielectric (ILD) structure on the dielectric hardmask layer, the ILD structure having portions between adjacent ones of the plurality of conductive lines and having a dielectric plug portion in the location of the break in the one of the conductive lines, the dielectric plug portion of the ILD structure continuous with one or more of the portions of the ILD structure between adjacent ones of the plurality of conductive lines, wherein the dielectric plug portion of the ILD structure is on a portion of the dielectric hardmask layer having a first thickness, and the portions of the ILD structure between adjacent ones of the plurality of conductive lines are on a portion of the dielectric hardmask layer having a second thickness, the second thickness greater than the first thickness.

A computing device, comprising:

• a board;
• and
• a component coupled to the board, the component including an integrated circuit structure, comprising:
• a plurality of conductive lines along a same direction, one of the conductive lines having a break therein;
• and
• an inter-layer dielectric (ILD) structure having portions between adjacent ones of the plurality of conductive lines and having a dielectric plug portion in a location of the break in the one of the conductive lines, the dielectric plug portion of the ILD structure continuous with one or more of the portions of the ILD structure between adjacent ones of the plurality of conductive lines, and the dielectric plug portion of the ILD structure having an inwardly tapering profile from top to bottom, wherein the ILD structure is on a dielectric hardmask layer, and wherein the dielectric plug portion of the ILD structure is on a portion of the dielectric hardmask layer having a first thickness, the portions of the ILD structure between adjacent ones of the plurality of conductive lines are on a portion of the dielectric hardmask layer having a second thickness, the second thickness greater than the first thickness.

A computing device, comprising:

• a board;
• and
• a component coupled to the board, the component including an integrated circuit structure, the integrated circuit structure comprising:
• a plurality of conductive lines along a same direction, one of the conductive lines having a break therein;
• a dielectric hardmask layer having portions between adjacent ones of the plurality of conductive lines and having a portion in a location of the break in the one of the conductive lines;
• and
• an inter-layer dielectric (ILD) structure on the dielectric hardmask layer, the ILD structure having portions between adjacent ones of the plurality of conductive lines and having a dielectric plug portion in the location of the break in the one of the conductive lines, the dielectric plug portion of the ILD structure continuous with one or more of the portions of the ILD structure between adjacent ones of the plurality of conductive lines, wherein the dielectric plug portion of the ILD structure is on a portion of the dielectric hardmask layer having a first thickness, and the portions of the ILD structure between adjacent ones of the plurality of conductive lines are on a portion of the dielectric hardmask layer having a second thickness, the second thickness greater than the first thickness.