Enhanced electrostatic wafer chuck designs
AssigneeIntel Corporation
InventorRobert Chroneos, Jr.
Life of this patent
Estimating the term…
Abstract
This disclosure describes electrostatic wafer chuck designs for holding and heating semiconductor wafers. An electrostatic wafer chuck may include a metal base; a temperature sensor; and a multi-layer ceramic plate including: a bonding layer; a heater; a first dielectric positioned between the heater and the bonding layer; an electrode to electrostatically hold a semiconductor wafer; a second dielectric positioned between the heater and the electrode; a heat spreader to uniformly distribute heat from the heater to the semiconductor wafer; and a third dielectric positioned between the electrode and the semiconductor wafer; and a temperature sensor may extend through the metal base and at least partially through the multi-layer ceramic plate.
Claims17
An electrostatic wafer chuck for holding and heating semiconductor wafers, the electrostatic wafer chuck comprising:
- a metal base;
- a temperature sensor;
- and
- a multi-layer ceramic plate comprising:
- a bonding layer;
- a heater;
- a first dielectric positioned between the heater and the bonding layer;
- an electrode configured to electrostatically hold a semiconductor wafer;
- a second dielectric positioned between the heater and the electrode;
- a heat spreader configured to uniformly distribute heat from the heater to the semiconductor wafer;
- and
- a third dielectric positioned between the electrode and the semiconductor wafer, wherein the temperature sensor extends through the metal base and through the multi-layer ceramic plate to have a direct line of sight to the semiconductor wafer.
An electrostatic wafer chuck for holding and heating semiconductor wafers, the electrostatic wafer chuck comprising:
- a metal base;
- a temperature sensor extending through the metal base and through the multi-layer ceramic plate to have a direct line of sight to the semiconductor wafer;
- and
- the multi-layer ceramic plate, comprising:
- a bonding layer;
- a heater;
- a first dielectric positioned between the heater and the bonding layer;
- an electrode configured to electrostatically hold a semiconductor wafer;
- a second dielectric positioned between the heater and the electrode;
- a heat spreader configured to uniformly distribute heat from the heater to the semiconductor wafer;
- and
- a third dielectric positioned between the electrode and the semiconductor wafer.
A system for holding and heating semiconductor wafers, the system comprising:
- an electrostatic wafer chuck operatively connected to a temperature control system, the electrostatic wafer chuck comprising:
- a metal base;
- a temperature sensor;
- and
- a multi-layer ceramic plate comprising:
- a bonding layer;
- a heater;
- a first dielectric positioned between the heater and the bonding layer;
- an electrode configured to electrostatically hold a semiconductor wafer;
- a second dielectric positioned between the heater and the electrode;
- a heat spreader configured to uniformly distribute heat from the heater to the semiconductor wafer;
- and
- a third dielectric positioned between the electrode and the semiconductor wafer, wherein the temperature sensor extends through the metal base and through the multi-layer ceramic plate to have a direct line of sight to the semiconductor wafer.
Dependencies are inferred from the claim text.