Etching control device, etching control method, and etching control system

An etching control method performed by an etching control device, the etching control method comprising:

• updating, to optimize a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, a parameter of the model;
• calculating, by using the model whose parameter has been updated in the updating of the parameter of the model, the process parameter corresponding to distribution of a designated etching amount;
• updating a process recipe defining operations of the multiple nozzles based on the calculated process parameter;
• and
• controlling the operations of the multiple nozzles by using the process parameter,
• wherein the multiple nozzles include a first nozzle configured to discharge a rinse on the substrate being rotated, and a second nozzle configured to discharge a chemical liquid to etch the substrate being rotated,
• wherein, in the controlling of the operations of the multiple nozzles, the discharge of the first processing liquid from the first nozzle and the discharge of the second processing liquid from the second nozzle are simultaneously controlled during an etching process,
• wherein the controlling of the operations of the multiple nozzles includes controlling the operations of the multiple nozzles according to the updated process recipe,
• wherein the model is a neural network, and
• the updating includes updating parameters of the neural network by using an error back-propagation method based on training data including an etching amount distribution and corresponding process parameters.

An etching control system comprising:

• a measuring device configured to measure distribution of an etching amount of a substrate;
• and
• an etching control device,
• wherein the etching control device comprises:
• a parameter updating unit configured to update, to optimize a model indicating a relationship between the distribution of the etching amount within a surface of the substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, a parameter of the model;
• a calculator configured to calculate, by using the model whose parameter has been updated by the parameter updating unit, the process parameter corresponding to distribution of a designated etching amount measured by the measuring device;
• and
• an operation controller configured to control the operations of the multiple nozzles by using the process parameter;
• a recipe updating unit configured to update a process recipe defining operations of the multiple nozzles based on the process parameter calculated by the calculator;
• wherein the multiple nozzles include a first nozzle configured to discharge a rinse on the substrate being rotated, and a second nozzle configured to discharge a chemical liquid to etch the substrate being rotated, and
• wherein the operation controller is further configured to simultaneously control the discharge of the rinse from the first nozzle and the discharge of the chemical liquid from the second nozzle during an etching process,
• wherein the operation controller is further configured to control the operations of the multiple nozzles according to the process recipe updated based on the process parameter,
• wherein the model is a neural network, and
• the parameter updating unit is further configured to update parameters of the neural network by using an error back-propagation method based on training data including an etching amount distribution and corresponding process parameters.