US 12,765,286 B2Granted

Substrate processing apparatus and substrate processing method

AssigneeTokyo Electron Limited

InventorsHayato Tanoue, Kento Araki, Yohei Yamashita, Gousuke Shiraishi

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Abstract

A substrate processing apparatus configured to process a combined substrate in which a first substrate, an interface layer including at least a laser absorbing film, and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; an interface laser radiating unit configured to radiate laser light to the laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the interface laser radiating unit relative to each other; and a controller. The controller performs a control of acquiring information of the interface layer formed in the combined substrate, and a control of setting, based on the acquired information of the interface layer, a bonding interface having a weakest adhesive strength among bonding interfaces in the interface layer as a separation interface between the first substrate and the second substrate.

Claims13

Dependent claims

A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are stacked on top of each other, the substrate processing apparatus comprising:

a substrate holder configured to hold the combined substrate;
a laser radiating unit configured to radiate laser light;
a moving mechanism configured to move the substrate holder and the laser radiating unit relative to each other;
and
a controller and a storage storing a computer program, wherein the storage and the computer program are configured, with the controller, to control the laser radiating unit and the moving mechanism,
wherein an interface layer includes a plurality of films including a laser absorbing film stacked between the first substrate and the second substrate, and
wherein the controller performs:
a control of acquiring information of the interface layer formed in the combined substrate:
a control of setting, based on the acquired information of the interface layer, a bonding interface having a weakest adhesive strength among bonding interfaces in the interface layer as a separation interface between the first substrate and the second substrate;
a control of deciding an interval of the laser light to be radiated to the laser absorbing film depending on the set separation interface;
and
a control of radiating the laser light to the laser absorbing film in a pulse shape at the decided interval.

9 more elements

A substrate processing method of processing a combined substrate in which a first substrate and a second substrate are stacked on top of each other, wherein an interface layer includes a plurality of films including a laser absorbing film stacked between the first substrate and the second substrate, the substrate processing method comprising:

acquiring information of the interface layer formed in the combined substrate;
setting, based on the acquired information of the interface layer, a bonding interface having a weakest adhesive strength among bonding interfaces in the interface layer as a separation interface between the first substrate and the second substrate;
determining an interval of laser light to be radiated to the laser absorbing film depending on the set separation interface;
and
radiating the laser light to the laser absorbing film in a pulse shape at the determined interval.

2 more elements

Dependencies are inferred from the claim text.