Display panel and method for manufacturing same, and display device

A method for manufacturing a display panel, comprising:

• forming a light-emitting device on a side of a driving backplane;
• forming a package structure on a side, facing away from the driving backplane, of the light-emitting device, wherein the package structure comprises an inorganic package structure and an organic package structure, the inorganic package structure being closer to the driving backplane than the organic package structure, and the inorganic package structure comprises:
• a first inorganic package structure and a second inorganic package structure that are laminated, and a compactness of the second inorganic package structure is greater than a compactness of the first inorganic package structure;
• and
• forming a color stop layer on a side, facing away from the driving backplane, of the organic package structure, wherein the color stop layer is attached to the organic package structure, the driving backplane comprises a base substrate, and in a direction perpendicular to the base substrate, a maximum thickness of the organic package structure is less than a thickness of the inorganic package structure.

A display device, comprising:

• a power supply assembly, and a display panel electrically connected to the power supply assembly, wherein the display panel comprises:
• a driving backplane, comprising a base substrate;
• a light-emitting device on a side of the driving backplane;
• a package structure on a side, facing away from the driving backplane, of the light-emitting device, wherein the package structure comprises an inorganic package structure and an organic package structure, the inorganic package structure being closer to the driving backplane than the organic package structure, and the inorganic package structure comprises:
• a first inorganic package structure and a second inorganic package structure that are laminated, and a compactness of the second inorganic package structure is greater than a compactness of the first inorganic package structure;
• and
• a color stop layer on a side, facing away from the driving backplane, of the organic package structure, wherein the color stop layer is attached to the organic package structure, and in a direction perpendicular to the base substrate, a maximum thickness of the organic package structure is less than a thickness of the inorganic package structure.