ULED light-emitting and display device without electrical contact, external carrier injection and mass transfer and preparation method thereof

A method for manufacturing a micro light emitting diode (μLED) light-emitting and display device without electrical contact, external carrier injection and mass transfer, comprising the following steps:

• in Step1, obtaining a self-supporting μLED chip which comprises a P-type semiconductor layer, a light emitting layer and an N-type semiconductor layer stacked to form a light-emitting semiconductor junction, wherein the μLED chip is obtained by growing an LED thin film structure capable of generating a light source in three primary colors red, green, and blue on a surface of a semiconductor substrate and forming a μLED chip pattern with a desired size by cutting and peeling;
• in Step2, preparing a lower electrode array of a sub-pixel having three primary colors red, green, and blue, a thin film transistor driving array, and an electrical connection line therebetween on the surface of the substrate;
• in Step3, realizing non-electrical contact between the μLED chip and a corresponding sub-pixel lower electrode through an insulation layer preparation process by disposing red, green and blue μLED chips on a surface of a lower electrode of the sub-pixel having three primary colors red, green, and blue correspondingly and respectively;
• and
• in Step4, realizing non-electrical contact between the μLED chip and a corresponding sub-pixel upper electrode through the insulation layer preparation process by disposing a pixel upper electrode and an electrical connection line thereof on the surface of the substrate provided with red, green and blue μLED chips, so as to obtain the μLED light-emitting and display device without electrical contact, external carrier injection and mass transfer.