Chip package and manufacturing method thereof

A manufacturing method of a chip package, comprising:

• bonding a mother light transmissive sheet to a first support layer on a top surface of a wafer, wherein the top surface of the wafer has a conductive pad and a first light receiver, the mother light transmissive sheet covers the first light receiver and has a trench;
• etching a bottom surface of the wafer to form a recess or a through hole that exposes the conductive pad;
• forming a redistribution layer electrically connected to the conductive pad and extending to the bottom surface of the wafer;
• forming a conductive structure on the redistribution layer on the bottom surface of the wafer;
• grinding a top surface of the mother light transmissive sheet to form a first light transmissive sheet at one side of the trench, wherein the first light transmissive sheet is located on a top surface of the first support layer;
• cutting the first light transmissive sheet, the first support layer, and the wafer such that the wafer forms a chip;
• disposing a light emitter on a top surface of the chip, wherein a top surface of the light emitter is higher than the top surface of the first support layer and a bottom surface of the first light transmissive sheet;
• and
• disposing a transparent glue to cover the light emitter, wherein an entire top surface of the transparent glue is coplanar with a top surface of the first light transmissive sheet.