Semiconductor device with resistor and method for manufacturing same
AssigneeSony Semiconductor Solutions Corporation
InventorsHirokazu Ejiri, Jun Ogi, Yuki Kawahara, Chigusa Yamane
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Abstract
To provide a semiconductor device with which it is possible to reduce parasitic capacitance between electrodes for a resistance element, and a method for manufacturing the semiconductor device. A semiconductor device according to the present disclosure includes: a substrate; a first resistance layer provided on the substrate; a first electrode in contact with a lower surface of the first resistance layer; and a second electrode in contact with an upper surface of the first resistance layer.
Claims19
A semiconductor device, comprising:
- a substrate;
- a first resistance layer provided on the substrate;
- a first electrode in contact with a lower surface of the first resistance layer;
- and
- a second electrode in contact with an upper surface of the first resistance layer,
- wherein the first resistance layer includes a first layer and a second layer having an electrical resistivity lower than an electrical resistivity of the first layer,
- wherein the second layer includes a first portion having a bottom surface that is connected with the first electrode and a second portion having a top surface that is coupled with the second electrode via the first resistance layer,
- wherein the second portion is separated from the first portion and a bottom surface of the second portion is free of electrical connection.
A method for manufacturing a semiconductor device, the method comprising:
- forming a first electrode on a substrate;
- forming a first resistance layer in contact with an upper surface of the first electrode;
- and
- forming a second electrode in contact with an upper surface of the first resistance layer,
- wherein the first resistance layer is formed to have a first layer and a second layer having an electrical resistivity lower than an electrical resistivity of the first layer,
- wherein the second layer is formed to have a first portion having a bottom surface that is connected with the first electrode and a second portion having a top surface that is coupled with the second electrode via the first resistance layer, and
- wherein the second portion is separated from the first portion and a bottom surface of the second portion is free of electrical connection.
Dependencies are inferred from the claim text.