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US 12,765,084 B2Granted
Backside illuminated image sensor
AssigneeDB HiTek Co., Ltd.
InventorsChang Hun Han, Man Lyun Ha, Tae Wook Kang
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Abstract
A backside illuminated image sensor includes a substrate having a frontside surface and a backside surface, pixel regions formed in the substrate, light isolation patterns formed among the pixel regions, first bonding pads electrically connected to the pixel regions, and at least one second bonding pad electrically connected to the light isolation patterns.
Claims7
A backside illuminated image sensor comprising:
- a substrate having a frontside surface and a backside surface;
- pixel regions formed in the substrate;
- light isolation patterns formed among the pixel regions and interconnected to surround the pixel regions;
- first bonding pads electrically connected to the pixel regions;
- and
- a light blocking pattern formed along the backside surface of the substrate, the light blocking pattern being made of a same material as the light isolation patterns and integrally connected with the light isolation patterns, wherein the light blocking pattern is not in contact with the first bonding pads;
- and
- at least one second bonding pad directly contacting the light blocking pattern, electrically connected to the light isolation patterns through the light blocking pattern, and configured to apply a negative voltage to the light isolation patterns through the light blocking pattern,
- wherein the at least one second bonding pad is not in direct contact with the light isolation patterns.
6 more elements
Dependencies are inferred from the claim text.