Semiconductor processing tool and methods of operation

A method, comprising:

• receiving a semiconductor substrate on a bonding fixture including an inflatable forcing structure in a recess of a chuck component;
• activating a vacuum supply system to draw a vacuum through a plurality of vacuum port structures that pass through the inflatable forcing structure to draw the semiconductor substrate against a surface of the inflatable forcing structure;
• activating a gas supply system to provide a pressurized gas through a gas inlet port structure that enters the inflatable forcing structure to inflate the inflatable forcing structure;
• and
• performing a bonding operation that joins the semiconductor substrate with another semiconductor substrate after inflating the inflatable forcing structure.

A bonding tool, comprising:

• a processing chamber;
• and
• a bonding fixture, in the processing chamber, configured to hold a semiconductor substrate and comprising:
• a chuck component;
• an inflatable forcing structure within a recess of the chuck component;
• a vacuum port structure passing through the chuck component and through the inflatable forcing structure, and configured to provide a vacuum force that holds a bond region of the semiconductor substrate against the inflatable forcing structure;
• and
• a gas inlet port structure passing through the chuck component and into the inflatable forcing structure, and configured to provide a pressurized gas to inflate the inflatable forcing structure to form a convex curvature along an outer surface of the inflatable forcing structure that protrudes outside the recess, and to provide a force that deforms the bond region of the semiconductor substrate during a bonding operation that joins the semiconductor substrate with another semiconductor substrate.