Patterning a functional layer by means of a sacrificial layer and preparing a MIM capacitor implementing said patterning

Abstract

The invention relates, firstly, to a method for patterning a functional layer (130), comprising at least the following steps of: providing a substrate (110) having a surface locally covered by a so-called sacrificial layer (120), one or more areas of the surface of the substrate (110) being devoid of the sacrificial layer (120); selectively growing the functional layer (130) on the area(s) of the surface of the substrate (110) devoid of the sacrificial layer (120); eliminating the sacrificial layer (120); whereby the surface of the substrate (110) is covered by a patterned functional layer (130). Subsequently, the invention relates to a method for preparing a MIM capacitor, implementing the patterning method for patterning at least one layer of the capacitor. Applications: micro- and nano-electronic devices such as electronic chips, manufacturing of high-density MIM capacitors.

Dependencies are inferred from the claim text.