Uniform temperature plate and electronic equipment employing plate

An electronic equipment comprising a first chip and a uniform temperature plate, wherein the first chip is arranged close to a first surface of the uniform temperature plate, the uniform temperature plate comprises:

• a first plate;
• a second plate enclosed with the first plate to form a containing cavity, wherein the containing cavity is filled with working liquid, the containing cavity comprises an evaporation zone and a condensation zone;
• a braided wire having a capillary structure, wherein the braided wire comprises a plurality of intertwined metal wires, the braided wire is arranged in the containing cavity, a first end of the braided wire is arranged in the evaporation zone, a second end of the braided wire is arranged in the condensation zone;
• and
• a capillary structure layer, arranged on the first plate or on the second plate, the capillary structure layer comprising a plurality of round holes;
• wherein the first plate comprises a plurality of first convexes in a direction facing the containing cavity, positions of the plurality of round holes are arranged corresponding to positions of the plurality of first convexes.