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US 12,764,875 B2Granted
Damper for a printed circuit board assembly
AssigneeMicron Technology, Inc.
InventorsKaleb A. Wilson, Bradley R. Bitz, Mark A. Tverdy, Quang Nguyen, Christopher Glancey, Jagadeesh B. Ginjupalli, Pridhvi Dandu
Life of this patent
Estimating the term…
Abstract
Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.
Claims20
An apparatus, comprising:
- a printed circuit board assembly (PCBA) of a solid state drive (SSD);
- and
- a damper comprising:
- a pedestal portion;
- a first preloaded spring portion;
- and
- a second preloaded spring portion,
- wherein the damper is configured to:
- receive the PCBA via the first preloaded spring portion, the second preloaded spring portion, and the pedestal portion of the damper;
- contact the PCBA, wherein the first pre-loaded spring portion contacts a first edge of a first surface of the PCBA and a second pre-loaded spring portion contacts a second edge of the first surface of the PCBA, and the pedestal portion of the damper contacts a second surface of the PCBA that is opposite the first surface of the PCBA;
- contact an enclosure of the SSD;
- and
- damp shock impulses applied to the SSD, wherein the damper is configured to deform in response to the shock impulses.
10 more elements
A method, comprising:
- removably coupling a printed circuit board assembly (PCBA) of a solid state drive (SSD) to an enclosure of the SSD via a damper with a first pre-loaded spring portion configured to contact a first edge of a first surface of the PCBA, a second pre-loaded spring portion configured to contact a second edge of the first surface of the PCBA, and a pedestal portion configured to contact a second surface of the PCBA that is opposite the first surface of the PCBA;
- and
- damping a shock impulse between the enclosure and the PCBA via the damper, wherein the first pre-loaded spring portion, the second pre-loaded spring portion, and the pedestal portion are configured to deform in response to the shock impulse.
A system, comprising:
- a damper with a first pre-loaded spring portion, a second pre-loaded spring portion, and a pedestal portion;
- a printed circuit board assembly (PCBA);
- and
- a first and second portion of an enclosure configured to enclose the damper and the PCBA, wherein the first pre-loaded spring portion and the second pre-loaded spring portion of the damper are configured to receive the PCBA by contacting a first edge and a second edge of a first surface of the PCBA and the pedestal portion is configured to contact a second surface of the PCBA opposite the first surface of the PCBA and damp shock impulses applied to the system, and wherein the damper is configured to deform in response to the shock impulses.
1 more element
Dependencies are inferred from the claim text.