Printed circuit board assembly
AssigneeMurrelektronik GmbH
InventorsHeiko Feisst, Jan Maier, Tim Roolf, Henrik Ruf
Life of this patent
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Abstract
A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.
Claims20
A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, the housing being formed in a pot shape and has a housing bottom and sidewalls, the housing having a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, and the housing having at least one bearing surface on which a gap filler is arranged, the bearing surface being formed on the shoulder portion, wherein the electronic component rests against the gap filler so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, wherein the gap filler is thermally conductive, wherein the gap filler is adhesive so that the printed circuit board is bonded onto the bearing surface via the electronic component by means of the gap filler, wherein the electronic component is connected to the housing in a thermally conductive manner as the electronic component is directly coupled to the housing via the gap filler, as a result of which a heat conduction to the housing via the gap filler is established from which heat is released to the surroundings, a potting compound being provided, which covers at least an upper side of the printed circuit board and contacts the gap filler that serves as a rest for the potting compound, and wherein the gap filler stops coverage of the potting compound at the bearing surface.
A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, the housing being formed in a pot shape and has a housing bottom and sidewalls, and the housing having at least one bearing surface being parallel to the housing bottom, wherein being parallel to the housing bottom, wherein a gap filler is arranged on the bearing surface, wherein the electronic component rests on the gap filler so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, and wherein the gap filler is electrically non-conductive, wherein a potting compound is provided, wherein the electronic component is partially limited by the gap filler and the potting compound such that the potting compound contacts the electronic component, and wherein the potting compound covers an upper side of the printed circuit board and the gap filler stops coverage of the potting compound at the bearing surface.
A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, wherein the housing is formed in a pot shape and has a housing bottom and sidewalls, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, wherein the housing has a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, the bearing surface being formed on the shoulder portion such that the bearing surface is parallel to the housing bottom, wherein a potting compound is provided that covers an upper side of the printed circuit board and partially rests on the bearing surface formed on the shoulder portion where the potting compound contacts the gap filler and the gap filler stops coverage of the potting compound at the bearing surface.
Dependencies are inferred from the claim text.