Substrate with embedded conductive coin

A substrate, comprising:

• a first dielectric layer;
• a conductive coin embedded in the first dielectric layer;
• a first conductive layer formed on a first side of the first dielectric layer, the first conductive layer contacting a first side of the conductive coin;
• an embedded circuit component mounted on the first conductive layer;
• a second dielectric layer formed over the first conductive layer and covering the embedded circuit component;
• a second conductive layer formed over the second dielectric layer and extending over the embedded circuit component;
• and
• a via electrically connecting the second conductive layer to the embedded circuit component.

An integrated circuit (IC) package, comprising:

• a substrate, comprising:
• a first dielectric layer;
• a conductive coin embedded in the first dielectric layer;
• a first conductive layer formed on a first side of the first dielectric layer;
• a cavity in the first conductive layer, the cavity located over the conductive coin;
• an embedded circuit component arranged in the cavity in the first conductive layer, wherein the embedded circuit component is located over the conductive coin and conductively coupled to the conductive coin;
• a second dielectric layer formed over the first conductive layer;
• a second conductive layer formed over the second dielectric layer;
• and
• a via extending through the second dielectric layer, the via electrically connecting the second conductive layer to the embedded circuit component;
• and
• an electronic device mounted on a first side of the substrate, wherein the electronic device is electrically connected to a first respective element of the embedded circuit component through the via.

A method of forming a substrate, the method comprising:

• forming a first dielectric layer including a coin opening;
• embedding a conductive coin in the coin opening in the first dielectric layer;
• forming a first conductive layer on a first side of the first dielectric layer, the first conductive layer including a cavity located over the conductive coin;
• mounting an embedded circuit component in the cavity in the first conductive layer, wherein the mounted embedded circuit component is conductively coupled to the conductive coin;
• forming a second dielectric layer over the first conductive layer;
• forming a second conductive layer over the second dielectric layer;
• and
• forming a via extending through the second dielectric layer, the via electrically connecting the second conductive layer to the embedded circuit component.