Radiation-emitting laser component and method for producing a radiation-emitting laser component

A method for producing a radiation emitting laser component, comprising:

• providing an edge-emitting laser diode comprising a contact layer,
• providing a substrate having a substrate bar,
• applying a solder material to the substrate bar or the contact layer, and
• applying the edge-emitting laser diode to the substrate,
• heating the solder material to a first temperature,
• producing a solder layer by cooling the solder material, wherein
• the contact layer is mechanically stably connected to the substrate bar by means of the solder layer,
• the substrate bar and the contact layer have a same width,
• the edge-emitting laser diode has a semiconductor body with a ridge,
• the ridge of the semiconductor body and the substrate bar face each other, and
• a width of the substrate bar is smaller than a width of the semiconductor body.

A radiation emitting laser component comprising:

• an edge-emitting laser diode configured to generate electromagnetic laser radiation;
• and
• a substrate on which the edge-emitting laser diode is arranged,
• wherein:
• the edge-emitting laser diode comprises a contact layer,
• the edge-emitting laser diode comprises a semiconductor body with a ridge,
• the ridge of the semiconductor body is embedded in the contact layer,
• the substrate has a substrate bar,
• the contact layer is mechanically stably connected to the substrate bar by means of a solder layer,
• the ridge of the semiconductor body and the substrate bar face each other, and
• a width of the substrate bar is smaller than a width of the semiconductor body.