Systems, devices, and methods for wire harness manufacturing

A connector and wire connecting system, comprising:

• a work head movable relative to a wafer holder, the work head comprising:
• a first alignment structure secured in place on the work head and movable with the work head relative to the wafer holder;
• an induction heater comprising an induction coil having a first terminal and a second terminal, wherein the induction coil is configured in a manner that an electric current flows through the induction coil from the first terminal to the second terminal, the electric current creating an electromagnetic field adjacent to the induction coil forming a linearly extending heating zone adjacent to and not between the induction coil, the induction coil having substantially parallel arms, the induction coil being fixed in a position relative to the first alignment structure when the work head is moved relative to the wafer holder;
• a wafer connector with a plurality of wires along a linear interface, the linear interface being placeable within the heating zone, each wire of the plurality of wires being independently connectable to a respective pin of the wafer connector along a linear interface length, the heating zone having a linear length the same as or greater than the linear interface length;
• and
• the wafer holder configured to directly secure a wafer connector and a plurality of wires in a row to define a linear interface, each wire of the plurality of wires being independently connectable to a respective pin of the wafer connector and being independently connectable to a respective sleeve assembly, the linear interface being placeable within the heating zone when the work head is moved relative to the wafer holder, the wafer holder comprising:
• a body comprising a wafer support surface directly below the wafer connector when the wafer connector is directly secured by the wafer holder;
• a wafer restraint configured to directly secure the wafer connector in position on the wafer support surface;
• a wire restraint configured to directly secure a portion of each wire of the plurality of wires in position relative to the body, the wire restraint spaced apart from the wafer restraint and at least a portion of the wire restraint being fixed in position relative to the wafer restraint;
• and
• a second alignment structure comprising a second shape physically engageable with the first shape of the first alignment structure to prevent relative displacement of the work head and the wafer holder in a plurality of directions while giving freedom of movement in another direction and to align the parallel arms of the induction coil at a position adjacent to only one side of the linear interface and substantially parallel to the linear interface;
• and
• wherein the induction coil is disposed relative to the wafer connector and is configured to heat the linear interface between the wafer connector and the plurality of wires within the heating zone.

A connector and wire connecting system, comprising:

• a work head movable relative to a wafer holder, the work head comprising:
• a first alignment structure secured in place on the work head and movable with the work head relative to the wafer holder;
• an induction heater comprising an induction coil having a first terminal and a second terminal, the induction coil having substantially parallel arms, the induction coil being fixed in a position relative to the first alignment structure when the work head is moved relative to the wafer holder,
• wherein the induction coil is configured in a manner that an electric current flows through the induction coil from the first terminal to the second terminal, the electric current creating an electromagnetic field adjacent to the induction coil forming a heating zone;
• and
• the wafer holder configured to directly secure a wafer connector and a plurality of wires in a row to define a linear interface, each wire of the plurality of wires being independently connectable to a respective pin of the wafer connector and being independently connectable to a respective sleeve assembly, the linear interface being placeable within the heating zone, the wafer holder comprising:
• a body comprising a plate, the plate directly below the wafer connector when the wafer connector is directly secured by the wafer holder;
• a clamp configured to directly secure the wafer connector in position on the wafer support surface;
• a wire holder configured to directly secure a portion of each wire of the plurality of wires in position relative to the body, the wire holder spaced apart from the plate and at least a portion of the wire holder being fixed in position of the wafer holder relative to the plate;
• and
• a second alignment structure comprising a second shape, the second shape of the second alignment structure configured to be physically engageable with the first shape of the first alignment structure to prevent relative displacement of the work head and the wafer holder in a plurality of directions while giving freedom of movement in another direction and to align the parallel arms of the induction coil at a position adjacent to only one side of the linear interface and substantially parallel to the linear interface;
• and
• wherein the induction coil is disposed relative to the wafer holder and is configured to heat the linear interface between the wafer connector and the plurality of wires within the heating zone.