Multilayer electronic component

A multilayer electronic component, comprising:

• a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction, the body including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
• an external electrode disposed on the third and fourth surfaces;
• and
• a side margin portion disposed on the fifth and sixth surfaces,
• wherein the cover portion and the side margin portion include titanium (Ti) and gallium (Ga), and
• a ratio (B/A) of a number of moles (B) of gallium (Ga) compared to 100 moles of titanium (Ti) included in the side margin portion to a number of moles (A) of gallium (Ga) compared to 100 moles of titanium (Ti) included in the cover portion satisfies 1.5≤B/A.